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CY7C1021CV26
1-Mbit (64 K x 16) Static RAM
1-Mbit (64 K x 16) Static RAM
Features
an automatic power-down feature that significantly reduces power consumption when deselected. Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is written into the location specified on the address pins (A0 through A15). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O9 through I/O16) is written into the location specified on the address pins (A0 through A15). Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O1 to I/O8. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O9 to I/O16. See the truth table at the end of this data sheet for a complete description of Read and Write modes. The input/output pins (I/O1 through I/O16) are placed in a high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), the BHE and BLE are disabled (BHE, BLE HIGH), or during a Write operation (CE LOW, and WE LOW).
Temperature Range Automotive: -40 C to 125 C High speed tAA = 15 ns Optimized voltage range: 2.5 V to 2.7 V Low active power: 220 mW (Max) Automatic power-down when deselected Independent control of upper and lower bits CMOS for optimum speed/power Available in Pb-free and non Pb-free 44-pin TSOP II , 44-pin (400-Mil) Molded SOJ and Pb-free 48-ball FPBGA packages

Functional Description
The CY7C1021CV26 is a high-performance CMOS static RAM organized as 65,536 words by 16 bits. This device has
Logic Block Diagram
DATA IN DRIVERS
A7 A6 A5 A4 A3 A2 A1 A0
ROW DECODER
64K x 16 RAM Array
SENSE AMPS
I/O1-I/O8 I/O9-I/O16
COLUMN DECODER BHE WE CE OE BLE
Cypress Semiconductor Corporation Document Number: 38-05589 Rev. *E
*
A8 A9 A10 A11 A12 A13 A14 A15
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised December 1, 2010
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CY7C1021CV26
Contents
Selection Guide ................................................................ 3 Pin Configuration ............................................................. 3 Pin Definitions .................................................................. 3 Maximum Ratings ............................................................. 4 Operating Range ............................................................... 4 Electrical Characteristics ................................................. 4 Capacitance ...................................................................... 4 Thermal Resistance .......................................................... 4 AC Test Loads and Waveforms ....................................... 5 Switching Characteristics ................................................ 5 Switching Waveforms ...................................................... 7 Read Cycle No. 1 ........................................................ 7 Read Cycle No. 2 (OE Controlled) .............................. 7 Write Cycle No. 1 (CE Controlled) ............................... 8 Write Cycle No. 2 (BLE or BHE Controlled) ................ 8 Write Cycle No. 3 (WE Controlled, LOW) .................... 9 Truth Table ........................................................................ 9 Ordering Information ...................................................... 10 Ordering Code Definitions ......................................... 10 Package Diagrams .......................................................... 11 Acronyms ........................................................................ 13 Document Conventions ................................................. 13 Units of Measure ....................................................... 13 Document History Page ................................................. 14 Sales, Solutions, and Legal Information ...................... 15 Worldwide Sales and Design Support ....................... 15 Products .................................................................... 15 PSoC Solutions ......................................................... 15
Document Number: 38-05589 Rev. *E
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CY7C1021CV26
Selection Guide[1]
-15 Maximum Access Time Maximum Operating Current Maximum CMOS Standby Current 15 80 10 Unit ns mA mA
Pin Configuration[2]
TSOP II -Top View
A4 A3 A2 A1 A0 CE I/O1 I/O2 I/O3 I/O4 VCC VSS I/O5 I/O6 I/O7 I/O8 WE A15 A14 A13 A12 NC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
A5 A6 A7 OE BHE BLE I/O16 I/O15 I/O14 I/O13 VSS VCC I/O12 I/O11 I/O10 I/O9 NC A8 A9 A10 A11 NC
Pin Definitions
Pin Name A0-A15 Pin Number 1-5, 18-21, 24-27, 42-44 I/O Type Input Input/Output No Connect Input/Control Input/Control Input/Control Input/Control Description Address Inputs used to select one of the address locations. Bidirectional Data I/O lines. Used as input or output lines depending on operation. No Connects. This pin is not connected to the die. Write Enable Input, active LOW. When selected LOW, a Write is conducted. When selected HIGH, a Read is conducted. Chip Enable Input, active LOW. When LOW, selects the chip. When HIGH, deselects the chip. Byte Write Select Inputs, active LOW. BHE controls I/O16-I/O9, BLE controls I/O8-I/O1. Output Enable, active LOW. Controls the direction of the I/O pins. When LOW, the I/O pins are allowed to behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data pins. Ground for the device. Should be connected to ground of the system. Power Supply inputs to the device.
I/O1-I/O16 7-10, 13-16, 29-32, 35-38 NC WE CE 22, 23, 28 17 6
BHE, BLE 40, 39 OE 41
VSS VCC
12, 34 11, 33
Ground Power Supply
Notes 1. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ.), TA = 25 C. 2. NC pins are not connected on the die.
Document Number: 38-05589 Rev. *E
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Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Storage temperature ................................ -65 C to +150 C Ambient temperature with power applied ........................................... -55 C to +125 C Supply voltage on VCC to relative GND[3] .....-0.5 V to +4.6 V DC voltage applied to outputs in high Z state[3] ................................... -0.5 V to VCC + 0.5 V DC input voltage[3] ............................... -0.5 V to VCC + 0.5 V Current into outputs (LOW) ......................................... 20 mA Static discharge voltage........................................... > 2001 V (per MIL-STD-883, method 3015) Latch-up current ..................................................... > 200 mA
Operating Range
Range Automotive Ambient Temperature -40 C to +125 C VCC 2.5 V-2.7 V
Electrical Characteristics
Over the Operating Range Parameter VOH VOL VIH VIL IIX IOZ ICC ISB1 ISB2 Description Output HIGH voltage Output LOW voltage Input HIGH voltage Input LOW voltage[3] Input leakage current Output leakage current VCC operating supply current Automatic CE Power-Down Current --TTL inputs Automatic CE Power-Down Current --CMOS inputs GND < VI < VCC GND < VI < VCC, output disabled VCC = Max, IOUT = 0 mA, f = fMAX = 1/tRC Max VCC, CE > VIH, VIN > VIH or VIN < VIL, f = fMAX Max VCC, CE > VCC - 0.3 V, VIN > VCC - 0.3 V, or VIN < 0.3 V, f = 0 Test Conditions VCC = Min, IOH = -1.0 mA VCC = Min, IOL = 1.0 mA -15 Min 2.3 - 2.0 -0.3 -3 -3 - - - Max - 0.4 VCC + 0.3 0.8 +3 +3 80 15 10 Unit V V V V A A mA mA mA
Capacitance[4]
Parameter CIN COUT Description Input capacitance Output capacitance Test Conditions TA = 25 C, f = 1 MHz, VCC = 2.6 V Max 8 8 Unit pF pF
Thermal Resistance[4]
Parameter JA JC Description Test Conditions TSOP-II 76.92 15.86 Unit C/W C/W Thermal Resistance (Junction to Ambient) Still Air, soldered on a 3 x 4.5 inch, four-layer printed circuit board Thermal Resistance (Junction to Case)
Notes 3. VIL (min.) = -2.0V and VIH(max) = VCC + 0.5 V for pulse durations of less than 20 ns. 4. Tested initially and after any design or process changes that may affect these parameters.
Document Number: 38-05589 Rev. *E
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AC Test Loads and Waveforms[5]
2.6 V OUTPUT 30 pF INCLUDING JIG AND SCOPE R2 1976 R1 1830
2.6V GND
ALL INPUT PULSES 90% 10% 90% 10%
High Z characteristics: 2.6V OUTPUT 5 pF
R 317
R2 351
(a)
Rise Time: 1 V/ns
(b)
Fall Time: 1 V/ns
(c)
Switching Characteristics
Over the Operating Range[6] Parameter Read Cycle tRC tAA tOHA tACE tDOE tLZOE tHZOE tLZCE tHZCE tPU[9] tPD[9] tDBE tLZBE tHZBE Read cycle time Address to data valid Data hold from address change CE LOW to data valid OE LOW to data valid OE LOW to low Z[7] OE HIGH to high CE LOW to low Z[7, 8] Z[7] 15 - 3 - - 0 - 3 - 0 - - 0 - - 15 - 15 7 - 7 - 7 - 15 7 - 7 ns ns ns ns ns ns ns ns ns ns ns ns ns ns Description -15 Min Max Unit
CE HIGH to high Z[7, 8] CE LOW to power-up CE HIGH to power-down Byte enable to data valid Byte enable to low Z Byte disable to high Z
Notes 5. AC characteristics (except high Z) are tested using the Thevenin load shown in Figure (a). High Z characteristics are tested for all speeds using the test load shown in Figure (c) 6. Test conditions assume signal transition time of 2.6 ns or less, timing reference levels of 1.3 V, input pulse levels of 0 to 2.6 V. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 8. tHZOE, tHZBE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (d) of AC Test Loads. Transition is measured 500 mV from steady-state voltage. 9. This parameter is guaranteed by design and is not tested.
Document Number: 38-05589 Rev. *E
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CY7C1021CV26
Switching Characteristics
Over the Operating Range[6] (continued) Parameter Write Cycle[10] tWC tSCE tAW tHA tSA tPWE tSD tHD tLZWE tHZWE tBW Write cycle time CE LOW to write end Address set-up to write end Address hold from write end Address set-up to write start WE pulse width Data set-up to write end Data hold from write end WE HIGH to low Z[11] WE LOW to high Z[11, 12] Byte enable to end of write 15 10 10 0 0 10 8 0 3 - 9 - - - - - - - - - 7 - ns ns ns ns ns ns ns ns ns ns ns Description -15 Min Max Unit
Notes 10. The internal Write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE/BLE LOW. CE, WE and BHE/BLE must be LOW to initiate a Write, and the transition of these signals can terminate the Write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the Write. 11. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 12. tHZOE, tHZBE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (d) of AC Test Loads. Transition is measured 500 mV from steady-state voltage.
Document Number: 38-05589 Rev. *E
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CY7C1021CV26
Switching Waveforms
Read Cycle No. 1[13, 14]
tRC ADDRESS tOHA DATA OUT PREVIOUS DATA VALID tAA DATA VALID
Read Cycle No. 2 (OE Controlled)[14, 15]
ADDRESS tRC CE tACE OE BHE, BLE tDOE tLZOE tDBE tLZBE DATA OUT VCC SUPPLY CURRENT HIGH IMPEDANCE tLZCE tPU 50% DATA VALID tPD 50% tHZCE tHZBE tHZOE
HIGH IMPEDANCE
IICC CC IISB SB
Notes 13. Device is continuously selected. OE, CE, BHE and/or BLE = VIL. 14. WE is HIGH for Read cycle. 15. Address valid prior to or coincident with CE transition LOW.
Document Number: 38-05589 Rev. *E
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CY7C1021CV26
Switching Waveforms
(continued)
Write Cycle No. 1 (CE Controlled)[16, 17]
tWC ADDRESS
CE
tSA
tSCE
tAW tPWE WE tBW BHE, BLE tSD DATA I/O tHD
tHA
Write Cycle No. 2 (BLE or BHE Controlled)
tWC ADDRESS
BHE, BLE
tSA
tBW
tAW tPWE WE tSCE CE tSD DATA I/O tHD
tHA
Notes 16. Data I/O is high-impedance if OE or BHE and/or BLE= VIH. 17. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
Document Number: 38-05589 Rev. *E
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CY7C1021CV26
Switching Waveforms
(continued)
Write Cycle No. 3 (WE Controlled, LOW)
OE
tWC ADDRESS
CE
tSCE
tAW tSA WE tBW BHE, BLE tHZWE DATA I/O tSD tHD tPWE
tHA
tLZWE
Truth Table
CE H L OE X L WE X H BLE X L L H L X L L L H L L H X H X X H BHE X L H L L H L X H I/O1-I/O8 High Z Data Out Data Out High Z Data In Data In High Z High Z High Z I/O9-I/O16 High Z Data Out High Z Data Out Data In High Z Data In High Z High Z Power-down Read - All bits Read - Lower bits only Read - Upper bits only Write - All bits Write - Lower bits only Write - Upper bits only Selected, Outputs Disabled Selected, Outputs Disabled Mode Power Standby (ISB) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC)
Document Number: 38-05589 Rev. *E
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Ordering Information
Cypress offers other versions of this type of product in many different configurations and features. The following table contains only the list of parts that are currently available. For a complete listing of all options, visit the Cypress website at http://www.cypress.com and refer to the product summary page at http://www.cypress.com/products or contact your local sales representative. Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives and distributors. To find the office closest to you, visit us at http://www.cypress.com/go/datasheet/offices. Speed (ns) 15 Ordering Code CY7C1021CV26-15ZSXE CY7C1021CV26-15VXE CY7C1021CV26-15BAE CY7C1021CV26-15BAET CY7C1021CV26-15VXET CY7C1021CV26-15ZSXET Package Name Package Type Operating Range Automotive
51-85087 44-pin TSOP Type II (Pb-free) 51-85082 44-pin (400-Mil) Molded SOJ (Pb-free) 51-85150 48-ball FPBGA (6 x 8 x 1 mm) (Pb-free) 51-85150 48-ball FPBGA (6 x 8 x 1 mm) (Pb-free) 51-85082 44-pin (400-Mil) Molded SOJ (Pb-free) 51-85087 44-pin TSOP Type II (Pb-free)
Ordering Code Definitions
CY7C 1021 C V26 - 15 XXX E X X = T or Blank T = Tape and Reel; Blank = Tube Temperature Range: E = Automotive Package Type: XXX = ZSX or VX or BA ZSX = 44-pin TSOP Type II (Pb-free) VX = 44-pin (400-Mil) Molded SOJ (Pb-free) BA = 48-ball FPBGA (Pb-free) Speed Grade (15 ns) V26 = 2.6 V Process Technology 0.16 m 1021 = Part Identifier CY7C = Cypress SRAMs
Document Number: 38-05589 Rev. *E
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Package Diagrams
Figure 1. 44-pin TSOP II, 51-85087
51-85087 *C
51-85087-*A
Figure 2. 44-pin (400-Mil) Molded SOJ, 51-85082
51-85082 *C
Document Number: 38-05589 Rev. *E
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CY7C1021CV26
Package Diagrams (continued)
Figure 3. 48-ball FBGA (6 x 8 x 1 mm), 51-85150
51-85150 *F
Document Number: 38-05589 Rev. *E
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CY7C1021CV26
Acronyms
Acronym CMOS CE I/O OE SOJ SRAM TSOP TTL FPBGA WE chip enable input/output output enable small outline J-lead static random access memory thin small-outline package transistor-transistor logic fine-pitch ball grid array write enable Description complementary metal oxide semiconductor
Document Conventions
Units of Measure
Symbol ns V A mA mW MHz pF C W % nano seconds Volts micro Amperes milli Amperes milli Watts Mega Hertz pico Farad degree Celcius Watts percent Unit of Measure
Document Number: 38-05589 Rev. *E
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Document History Page
Document Title: CY7C1021CV26 1-Mbit (64 K x 16) Static RAM Document Number: 38-05589 REV. ** *A *B ECN NO. 238454 335861 493543 Issue Date See ECN See ECN See ECN Orig. of Change RKF SYT NXR Description of Change New data sheet for Automotive Added Lead-Free Product Information Included the 44-Lead (400-Mil) Molded SOJ V34 Package Changed the description of IIX from Input Load Current to Input Leakage Current in DC Electrical Characteristics table Removed IOS parameter from DC Electrical Characteristics table Updated Ordering Information Table Removed obsolete parts from ordering information table Updated package diagrams Updated Ordering Information and added Ordering Code Definitions. Updated Package Diagrams. Added Acronyms and Units of Measure. Minor edits and updated in new template.
*C *D *E
2897087 3057593 3098812
03/22/10 10/13/2010 12/01/2010
AJU PRAS PRAS
Document Number: 38-05589 Rev. *E
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Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives, and distributors. To find the office closest to you, visit us at Cypress Locations.
Products
Automotive Clocks & Buffers Interface Lighting & Power Control Memory Optical & Image Sensing PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/plc cypress.com/go/memory cypress.com/go/image cypress.com/go/psoc cypress.com/go/touch cypress.com/go/USB cypress.com/go/wireless
PSoC Solutions
psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 5
(c) Cypress Semiconductor Corporation, 2004-2010. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 38-05589 Rev. *E
Revised December 1, 2010
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